Elite Interfaces

2018 | PRIVACY POLICY
WE STRIVE FOR SUCCESS

Professional In-circuit & Testing Services

Contract Test Dont have ICT capability on your site ? Your volumes are too low to justify the purchase of an ICT system ? Let Elite Interfaces take the worry from you and provide a solution. Contract Testing of any batch size. Contact us for your board test needs.
Consultancy  Elite Interfaces have a wealth of experience across test disciplines and technologies in the Electronics Manufacturing Industry   -   Design for Test  -   Design for Manufacture -   Design for Automation
Elite offer a number of different  courses related to  ICT Development and support and can also design/tailor a course around your needs - Agilent HP3070 Workshop Training - Teradyne Spectrum Workshop Training - Teradyne 18XX Workshop Training
FEA Analysis ICT Fixturing can employ thousands of probes to contact test points on both sides of a PCB, and often it is not possible to completely balance the forces to offset strain on the UUT. It is however, possible to predict just how much strain there could be in a particular location on the board using Finite Element Analysis (FEA) modelling techniques. Get this part of the process wrong, and you could end up with; cracked components, PCB delamination, lifted component legs, or even broken tracks. Elite employ a 'state of the art' FEA modelling tool taking into account; probe position and force, pushrod and board stop position, and board thickness to simulate the strain on a PCB. Strain limits are checked in accordance with the test limits defined on Appendix A of the IPC/JEDEC-9704 standard entitled, "Printed Wiring Board Strain Gage Test Guideline"  
FStrain Gauge Testing Strain Testing of PCBs inside a Test Fixture If required as part of a fixture build, Elite  can offer two methods of analysing the strain experienced by the PCB inside a Test Fixture. Predictive Stress Analysis ICT Fixturing can employ thousands of probes to contact test points on both sides of a PCB, and often it is not possible to completely balance the forces to offset strain on the UUT. It is however, possible to predict just how much strain there could be in a particular location on the board using Finite Element Analysis (FEA) modelling techniques. Get this part of the process wrong, and you could end up with; cracked components, PCB delamination, lifted component legs, or even broken tracks. Elite employ a 'state of the art' FEA modelling tool taking into account; probe position and force, pushrod and board stop position, and board thickness to simulate the strain on a PCB. Strain limits are checked in accordance with the test limits defined on Appendix A of the IPC/JEDEC-9704 standard entitled, "Printed Wiring Board Strain Gage Test Guideline"
Strain Gauge Testing and Analysis As an extension of the predictive analysis previously mentioned, it becomes possible to measure the PCB's strain during the test actuation process and form an objective view as to whether any corrective actions need to take place. Small resistive sensors called stacked rosettes are fixed to the PCB in strategic locations, either predicted by the earlier FEA process or in close proximity to strain sensitive components. If required the customer can be provided with reports that are produced in accordance with the test limits defined on Appendix A of the IPC/JEDEC-9704 standard entitled, "Printed Wiring Board Strain Gage Test Guideline"
" Test-On-Demand TM  "        Test System Rental     Test-On-Demand TM  enables Electronics Manufacturers to acquire short and medium term ICT ATE Solutions using a mixture of rental and capital purchase options. The service offered by Elite recognises the need for both short term capacity and medium term business solutions in the current market conditions, namely poor visibility and fast changing capacity requirements on the production floor. Leading edge manufacturers will also  identify with the difficulty of balancing investment risk, production bottlenecks, and catching up with technology trends. The classic Cost – Time - Technology challenge. Elite understands that the cost effective acquisition of  the right technology at the right time can be difficult to manage, and have developed two complementary Rental Solutions focussed on short and medium term business needs while addressing today’s financial constraints and uncertainties. - Agilent - Teradyne Spectrum, 18XX - GenRad 228x Please contact us for your system rental needs on 01189 584600

ELITE INTERFACES

2018 | PRIVACY POLICY

Test Services

At Elite Interfaces, we have experienced testers to test all equipment

WE STRIVE FOR SUCCESS

Professional In-circuit & Testing Services

Contract Test Does your company have insufficient ICT capability on your site or are your volumes are too low to justify the purchase of an ICT system? Let Elite Interfaces take the worry from you and provide a solution. Contract Testing of any batch size. Contact us for your board test needs.
Consultancy  Elite Interfaces have a wealth of experience across test disciplines and technologies in the Electronics Manufacturing Industry   -   Design for Test  -   Design for Manufacture -   Design for Automation
Training Elite offer a number of different  courses related to  ICT Development and support and can also design/tailor a course around your needs - Agilent HP3070 Workshop Training - Teradyne Spectrum Workshop Training - Teradyne 18XX Workshop Training
FEA Analysis ICT Fixturing can employ thousands of probes to contact test points on both sides of a PCB, and often it is not possible to completely balance the forces to offset strain on the UUT. It is however, possible to predict just how much strain there could be in a particular location on the board using Finite Element Analysis (FEA) modelling techniques. Get this part of the process wrong, and you could end up with; cracked components, PCB delamination, lifted component legs, or even broken tracks. Elite employ a 'state of the art' FEA modelling tool taking into account; probe position and force, pushrod and board stop position, and board thickness to simulate the strain on a PCB. Strain limits are checked in accordance with the test limits defined on Appendix A of the IPC/JEDEC-9704 standard entitled, "Printed Wiring Board Strain Gauge Test Guideline"  
As an extension of the predictive analysis previously mentioned, it becomes possible to measure the PCB's strain during the test actuation process and form an objective view as to whether any corrective actions need to take place. Small resistive sensors called stacked rosettes are fixed to the PCB in strategic locations, either predicted by the earlier FEA process or in close proximity to strain sensitive components. If required the customer can be provided with reports that are produced in accordance with the test limits defined on Appendix A of the IPC/JEDEC-9704 standard entitled, "Printed Wiring Board Strain Gauge Test Guideline"
Please contact us for your system rental needs on 01189 584600
Strain Gauge Testing Strain Testing of PCBs inside a Test Fixture If required as part of a fixture build, Elite  can offer two methods of analysing the  strain experienced by the PCB inside a Test Fixture. Predictive Stress Analysis ICT Fixturing can employ thousands of probes to contact test points on both sides of a PCB, and often it is not possible to completely balance the forces to offset strain on the UUT. It is however, possible to predict just how much strain there could be in a particular location on the board using Finite Element Analysis (FEA) modelling techniques. Get this part of the process wrong, and you could end up with; cracked components, PCB delamination, lifted component legs, or even broken tracks. Elite employ a 'state of the art' FEA modelling tool taking into account; probe position and force, pushrod and board stop position, and board thickness to simulate the strain on a PCB. Strain limits are checked in accordance with the test limits defined on Appendix A of the IPC/JEDEC-9704 standard entitled, "Printed Wiring Board Strain Gauge Test Guideline"

ELITE INTERFACES

2018 | PRIVACY POLICY
Contract Test Does your company have insufficient ICT capability on your site or are your volumes are too low to justify the purchase of an ICT system? Let Elite Interfaces take the worry from you and provide a solution. Contract Testing of any batch size. Contact us for your board test needs.
Consultancy  Elite Interfaces have a wealth of experience across test disciplines and technologies in the Electronics Manufacturing Industry   -   Design for Test  -   Design for Manufacture -   Design for Automation
Elite offer a number of different  courses related to  ICT Development and support and can also design/tailor a course around your needs - Agilent HP3070 Workshop Training - Teradyne Spectrum Workshop Training - Teradyne 18XX Workshop Training
FEA Analysis ICT Fixturing can employ thousands of probes to contact test points on both sides of a PCB, and often it is not possible to completely balance the forces to offset strain on the UUT. It is however, possible to predict just how much strain there could be in a particular location on the board using Finite Element Analysis (FEA) modelling techniques. Get this part of the process wrong, and you could end up with; cracked components, PCB elamination, lifted component legs, or even broken tracks. Elite employ a 'state of the art' FEA modelling tool taking into account; probe position and force, pushrod and board stop position, and board thickness to simulate the strain on a PCB. Strain limits are checked in accordance with the test limits defined on Appendix A of the IPC/JEDEC-9704 standard entitled, "Printed Wiring Board Strain Gage Test Guideline"  
Strain Gauge Testing Strain Testing of PCBs inside a Test Fixture If required as part of a fixture build, Elite  can offer two methods of analysing the  strain experienced by the PCB inside a Test Fixture. Predictive Stress Analysis ICT Fixturing can employ thousands of probes to contact test points on both sides of a PCB, and often it is not possible to completely balance the forces to offset strain on the UUT. It is however, possible to predict just how much strain there could be in a particular location on the board using Finite Element Analysis (FEA) modelling techniques. Get this part of the process wrong, and you could end up with; cracked components, PCB delamination, lifted component legs, or even broken tracks. Elite employ a 'state of the art' FEA modelling tool taking into account; probe position and force, pushrod and board stop position, and board thickness to simulate the strain on a PCB. Strain limits are checked in accordance with the test limits defined on Appendix A of the IPC/JEDEC-9704 standard entitled, "Printed Wiring Board Strain Gauge Test Guideline"
As an extension of the predictive analysis previously mentioned, it becomes possible to measure the PCB's strain during the test actuation process and form an objective view as to whether any corrective actions need to take place. Small resistive sensors called stacked rosettes are fixed to the PCB in strategic locations, either predicted by the earlier FEA process or in close proximity to strain sensitive components. If required the customer can be provided with reports that are produced in accordance with the test limits defined on Appendix A of the IPC/JEDEC-9704 standard entitled, "Printed Wiring Board Strain Gauge Test Guideline"
Please contact us for your system rental needs on 01189 584600 

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