Test Services
Expert ICT outsourcing for high volume manufacturers of printed circuit boards and modules
By utilising our extensive range of in-house expertise and software tools, Elite Interfaces can provide complete turnkey test solutions for all major test platforms to include DFT analysis, project management, system integration, ICT and functional rest programming.
With in-depth experience across all major ICT platforms (Teradyne, GenRad and Keysight), the Elite client base contains many key electronics manufacturers, both OEM and CEM, drawn from consumer, computer, telecoms, automotive and aerospace industries.
The quality of our ICT programs and fixturing, combined with our on-going support ensures continuous repeat business from this customer base.
Elite's support infrastructure supports customers in every aspect of test, including applications, integration, installation, training and field maintenance. All delivered with an impeccable record of customer satisfaction through long term, mutually beneficial relationships.
Contract Test
Does your company have insufficient ICT capability on your site or are your volumes are too low to justify the purchase of an ICT system? Let Elite Interfaces take the worry from you and provide a solution. Contract Testing of any batch size. Contact us for your board test needs.
Consultancy
Elite Interfaces has a wealth of experience across test disciplines and technologies in the electronics manufacturing industry.
- Design for Test
- Design for Manufacture
- Design for Automation
Training
Elite provides a variety of courses related to ICT development and support and can also design/tailor a course around your needs.
- Keysight HP3070 Workshop Training
- Teradyne Spectrum Workshop Training
- Teradyne 18XX Workshop Training
FEA Analysis
ICT Fixturing can employ thousands of probes to contact test points on both sides of a PCB, and often it is not possible to completely balance the forces to offset strain on the UUT.
It is however, possible to predict just how much strain there could be in a particular location on the board using Finite Element Analysis (FEA) modelling techniques. Get this part of the process wrong, and you could end up with; cracked components, PCB delamination, lifted component legs, or even broken tracks.
Elite employs a 'state of the art' FEA modelling tool taking into account probe position and force, pushrod and board stop position, and board thickness to simulate the strain on a PCB.
Strain limits are checked in accordance with the test limits defined on Appendix A of the IPC/JEDEC-9704 standard entitled, "Printed Wiring Board Strain Gauge Test Guideline".
Strain Gauge Testing
Strain Testing of PCBs inside a Test Fixture
If required as part of a fixture build, Elite can offer two methods of analysing the strain experienced by the PCB inside a test fixture. Predictive stress analysis ICT fixturing can employ thousands of probes to contact test points on both sides of a PCB, and often it is not possible to completely balance the forces to offset strain on the UUT.
It is however, possible to predict just how much strain there could be in a particular location on the board using Finite Element Analysis (FEA) modelling techniques. Get this part of the process wrong, and you could end up with; cracked components, PCB delamination, lifted component legs, or even broken tracks.
Elite employs a 'state of the art' FEA modelling tool taking into account; probe position and force, pushrod and board stop position, and board thickness to simulate the strain on a PCB.
Strain limits are checked in accordance with the test limits defined on Appendix A of the IPC/JEDEC-9704 standard entitled, "Printed Wiring Board Strain Gauge Test Guideline"
As an extension of the predictive analysis previously mentioned, it becomes possible to measure the PCB's strain during the test actuation process and form an objective view as to whether any corrective actions need to take place. Small resistive sensors called stacked rosettes are fixed to the PCB in strategic locations, either predicted by the earlier FEA process or in close proximity to strain sensitive components.
As an extension of the predictive analysis previously mentioned, it becomes possible to measure the PCB's strain during the test actuation process and form an objective view as to whether any corrective actions need to take place. Small resistive sensors called stacked rosettes are fixed to the PCB in strategic locations, either predicted by the earlier FEA process or in close proximity to strain sensitive components.
Flash Programming · in-Circuit Test · Functional test
No other company provides a wider range of test solutions for PCB manufacturers than Elite Interfaces.
Since 1986, high volume electronics manufacturers have come to us for expert analysis, design and build of turnkey test solutions for all major test platforms.
If you need a test solution for the end of your production line for panellised boards or microcontroller boards, Elite Interfaces is the one stop shop, with an unsurpassed reputation for commitment, quality and customer service. Contact us now to discuss your current test solution challenge.
